A wafer-level packaging technique helps to implement silicon large-scale integration chips in a very thin film of thickness.

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A low-invasive flexible device developed based on a flip-chip bonding helps in monitoring brain activity.
Kenji Okabe, first author, said, "We have investigated how to integrate flexible antenna and high-performance circuits and tried this fabrication method with process conditions obtained through experiments.”
The technique is based on a flip-chip bonding. The researchers have fabricated a wireless power transmission (WPT) device including a flexible antenna and rectifier chip by using the proposed method.The WPT device can supply electricity to other circuits included in the neural interface.
Assistant Professor Ippei Akita, who is leading the project, said, "Using flexible device technology is a good solution to implement bio-compatible passive devices such as antennas or sensor electrodes. On the other hand, silicon-based integrated circuit technology, which has long history, is suitable for ultra-low-power systems with many functionalities. So, we believe that combining these technologies is essential to establish such minimum invasive implantable devices."
Researchers are trying to integrate more functions such as amplifiers, analog-to-digital converters, signal processors, and radio frequency circuits to an LSI chip. They conclude that this study may contribute to the development of safer BMI systems.
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